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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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Photo Mfr. Part # Stock Price Quantity Datasheet Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-6574-10

40-6574-10

CONN IC DIP SOCKET ZIF 40POS TIN

Aries Electronics

3101

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20.37
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40-6574-10

Datasheet

Tube 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
40-9513-10

40-9513-10

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2542

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8.73
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40-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1-2324271-8

1-2324271-8

LEFT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors

2459

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29.22
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1-2324271-8

Datasheet

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
1-2324271-7

1-2324271-7

RIGHT SEGMEN LGA4189-5 SOCKET-P5

TE Connectivity AMP Connectors

3944

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29.22
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1-2324271-7

Datasheet

Tray - Active LGA 4189 2092 0.039 (1.00mm) Gold 15.0µin (0.38µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 15.0µin (0.38µm) Copper Alloy Thermoplastic
2-2129710-8

2-2129710-8

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

2490

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37.37
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2-2129710-8

Datasheet

Tray - Active LGA 3647 - Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder - - - Copper Alloy Thermoplastic
2-2822979-4

2-2822979-4

CONN SOCKET LGA 3647POS GOLD

TE Connectivity AMP Connectors

2410

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65.76
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2-2822979-4

Datasheet

Tray - Active LGA 3647 0.039 (1.00mm) Gold 30.0µin (0.76µm) Copper Alloy Surface Mount Open Frame Solder 0.034 (0.86mm) Gold 30.0µin (0.76µm) Copper Alloy Thermoplastic
260-4204-01

260-4204-01

CONN SOCKET QFN 60POS GOLD

3M

3863

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143.86
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260-4204-01

Datasheet

Bulk Textool™ Active QFN 60 (4 x 15) 0.016 (0.40mm) Gold - Beryllium Copper Through Hole Open Frame Solder 0.016 (0.40mm) Gold - Beryllium Copper Polyethersulfone (PES)
NTE435P18

NTE435P18

SOCKET FOR 18 PIN DIP

NTE Electronics, Inc

722

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0.36
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NTE435P18

Datasheet

Bag - Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) - - - Through Hole Open Frame Solder 0.100 (2.54mm) - - - -
NTE423

NTE423

SOCKET-MINI-DIP 8-PIN

NTE Electronics, Inc

836

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0.46
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NTE423

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 8 (2 x 4) - - - - Through Hole - Solder - - - - -
NTE435P20

NTE435P20

IC 20 PIN DUAL INLINE

NTE Electronics, Inc

245

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0.46
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NTE435P20

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) - - - - Through Hole - Solder 0.100 (2.54mm) - - - -
NTE429

NTE429

28-PIN SOCKET

NTE Electronics, Inc

398

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0.55
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NTE429

Datasheet

Bulk - Active - 28 (2 x 14) - - - - Through Hole Open Frame Solder - - - - -
NTE409

NTE409

IC SOCKET 14 PIN DIP

NTE Electronics, Inc

202

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0.56
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NTE409

Datasheet

Bulk - Active - 14 (2 x 7) - - - - Through Hole - Solder - - - - -
NTE428

NTE428

24-PIN SOCKET

NTE Electronics, Inc

562

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0.68
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NTE428

Datasheet

Bulk - Active - 24 (2 x 12) - - - - Through Hole - Solder - - - - -
NTE435P6

NTE435P6

IC DUAL INLINE 6 PIN

NTE Electronics, Inc

3296

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0.69
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NTE435P6

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 6 (2 x 3) - - - - - - Solder 0.100 (2.54mm) - - - -
NTE430

NTE430

SOCKET 40 PIN

NTE Electronics, Inc

643

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0.84
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NTE430

Datasheet

Bulk - Active - 40 (2 x 20) - - - - Through Hole - Solder - - - - -
NTE435K30

NTE435K30

SOCKET-30 PIN DIP .070

NTE Electronics, Inc

192

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0.91
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NTE435K30

Datasheet

Bulk - Active DIP, 0.4 (10.16mm) Row Spacing - - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
NTE416

NTE416

SOCKET 16PIN DIP

NTE Electronics, Inc

440

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0.56
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NTE416

Datasheet

Bulk - Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) - - - - - Solder 0.100 (2.54mm) - - - -
NTE435K28

NTE435K28

SOCKET-28 PIN DIP .070

NTE Electronics, Inc

989

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0.82
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NTE435K28

Datasheet

Bulk - Active DIP, 0.4 (10.16mm) Row Spacing 28 (2 x 14) - - - - Through Hole - Solder 0.070 (1.78mm) - - - -
NTE435P42

NTE435P42

SOCKET-42 PIN DIP

NTE Electronics, Inc

3418

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1.61
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NTE435P42

Datasheet

Bulk - Active DIP, 0.6 (15.24mm) Row Spacing 42 (2 x 21) - - - - Through Hole - Solder 0.100 (2.54mm) - - - -
NTE421

NTE421

SOCKET-TO-66 PWR

NTE Electronics, Inc

3824

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1.64
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NTE421

Datasheet

Bulk - Active Transistor, TO-66 - - - - - Through Hole - Solder - - - - -
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